THERMELT 865 Black

优良的附着力，耐低温性能出色。 应用:耐低温及粘接力强 性能温度: -55°C~120°C 颜色: 黑色 / 琥珀色 肖氏硬度: 31D 安全等级: UL 94-V0 THERMELT产品范围： THERMELT181 THERMELT195 THERMELT867 THERMELT869 THERMELT865 THERMELT861 THERMELT858 THERMELT817 THERMELT866 THERMELT456 THERMELT870 THERMELT193 THERMELT816 THERMELT1564 TECHNOMELT产品范围： TECHNOMELT PA 673 TECHNOMELT PA 678 TECHNOMELT PA 682 TECHNOMELT PA 687 TECHNOMELT PA 2692 TECHNOMELT PA 633 TECHNOMELT PA 638 TECHNOMELT PA 652 TECHNOMELT PA 657 TECHNOMELT PA 6208 TECHNOMELT PA 6208 黑色 TECHNOMELT PA 341 TECHNOMELT PA 641 TECHNOMELT PA 646 TECHNOMELT PA 2384 TECHNOMELT PA 649 TECHNOMELT PA 668 TECHNOMELT PA 6344 TECHNOMELT PA 653 TECHNOMELT PA 658 TECHNOMELT PA 668 CLEAR TECHNOMELT TC 50 TECHNOMELT AS 8998 TECHNOMELT AS 5375

THERMELT 865 Black
POLYAMIDE HOT MELT RESIN




KEY FEATURES
- Excellent adhesion
- Good brittleness resistance at low
temperature
- Flammability UL94 : V0
(UL file E116659)


品牌型号：bostik thermelt 865


基本组成：Polyamide聚酰胺


外观颜色：Amber / Natural / Black


技术应用：低压注塑成型


熔胶温度：190 to 210


断裂延伸率：>200


软化点：149 to 165


硬度：31D


耐温：-55 to +120


阻燃：UL94-V0


产地：France法国


DESCRIPTION
nourde THERMELT 865 black is a pure copolymer polyamide hot
melt resin, non reactive and solvent free, specially
designed for Low Pressure Molding applications.


nourde low pressure molding material solutions


APPLICATIONS
nourde THERMELT 865 is mainly used for molding of
electronic/electric components, connectors and cables.




Viscosity Brookfield
(210℃, SC4, 50 RPM) [Pa.s] 2.5-3.5


Softening point [℃] 149-165 


Water content [%] < 0.2


Yield strength
(50 mm/min, 23℃) [MPa] > 2.8 ISO 527


Elongation at break
(50 mm/min, 23℃) [%] > 200 ISO 527


Commercial shape Pellets


Packaging 20Kg bag


Glass transition
(DSC) [℃] - 50 Bostik


Strength at break
(50 mm/min, 23℃) [MPa] 3.0 ISO 527




Density ~1 Internal test


Water absorption
(immersed, 23℃) [%] 3,0 ISO 62


Hardness [Shore D]
(23℃) 31 ISO 868




ELECTRICAL PROPERTIES 
Transversal
resistivity
(500V)
[Ω.cm] 2,8.10×11 IEC 60093


nourde low pressure molding material solutions


Dielectric rigidity
(23℃) [kV.mm-1] 18 IEC 60243-1


Relative permittivity
(50Hz, 23℃) [F.m-1] 5.7 IEC 60250




Melt Temperature Range [℃] 190-210


Mold Temperature Range [℃] 20-60


Drying Time
(Air oven, thin layer) [h] 8


Drying Temperature [℃] 70


Processing Moisture Content [%] < 0.2